General Informations
We develop bare dies or MMIC solutions” up to 100GHz, using the best available processes in order to optimize cost, performances, power consumption and small form factor packaging
Die Format
QFN Package
Flange Package
Testing EVB
Our RF/Microwave products offer includes: MMIC (GaAs, GaN/SiC, GaN/Si ) for medium and high-power functions, Low Noise Amplifiers , using Surface Mount package technologies (QFN, Flanged, Lead Frame) as well as connectorized housings (SMA, K, GPPO, …)